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Closed-Loop Gaseous Helium Cryopumps
by Kimo M. Welch
For more vacuum technology
information, please visit Mr. Welch's web site at www.vacuumtechnology.net
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There are numerous forms of
cryopumps. Liquid nitrogen traps, used in series with diffusion pumps,
are a form of cryopump.1 In 1960 Meissner reported on the use
of liquid nitrogen cooled coils for pumping water vapor within a vacuum
coating system.2 Sorption roughing pumps, filled with some
form of artificial zeolite (i.e., a sieve material) and chilled with liquid
nitrogen, are another form of cryopump.3,4 There are at least
seven forms of liquid helium cryopumps. The use of traps or coils cooled
with Freon-type liquid refrigerants have been with us for almost a half-century.5
This technology has been greatly refined in recent years by Missimer and
his colleagues at Polycold, and used in a wide variety of coating and
etch applications.6
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This column will discuss closed-loop gaseous helium cryopumps (cryopumps
hereafter). A comprehensive recommended practice on cryopumps was recently
published by the American Vacuum Society.7 The practice defines
how one quantitatively specifies the performance and characteristics of
a cryopump, technical terms, and safety considerations of cryopumps. It
is the work product of cryopump suppliers including APD, CTI, CVC, Genesis,
Leybold and other colleagues active in the industry over the last 25 years.
If you are in the market for a cryopump, you would be well advised to
first study reference 7. Also, a peak at reference 8 wouldn't hurt.
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Cryopumps came into being in the mid 1970s, finding first application in
the space simulation industry. A form of economical, clean (i.e., "dry"),
high-throughput pumping was needed to pump implanters and coating system
in the semiconductor industry. This proved to be the primary market encouragement
for their refinement and further development. However, soon after they came
into wide use in other PVD applications including use in decorative, functional
and optical coating systems. Single-stage cryopumps, appending turbopumps,
are a wave of the future. They are called cryoturbos, and have the advantages
of high water vapor speed, needing infrequent regeneration, and have unlimited
capacity for the lighter gases. Cost consideration presently limit their
use to some CVD and Ion Etch applications.
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Cryopump Configuration
A cryopump using a closed-loop, gaseous helium refrigerator (e.g., see
Fig. 1), consists of the refrigerator, cryopanels or arrays, and a pump
body. The refrigerator comprises a two?stage expander (1) connected to
a helium compressor (2) with flexible metal hoses (3). The system is called
a closed-loop refrigerator because on expansion of the high pressure
(~300 psig), room temperature helium gas in the expander, the low pressure
gas returns to the compressor. Work is done on the helium in the compressor,
and refrigeration is produced when the helium is expanded in the expander.
When the smoke clears, the heart of the cryopump is the refrigerator.
The shiny nickel-plated arrays, fancy control systems, valves, heaters,
gauges, etc., etc., mean nothing, absent a reliable refrigerator system.
In fact, the major breakthrough in cryopump technology was the development
of a compressor which could produce clean, oil-free, high pressure helium.8
Any substance in the helium stream other than helium, and perhaps a little
hydrogen, is a contaminant, and will degrade the performance of the refrigerator.
This will shortly become more obvious.
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The cryopanels comprise fabricated sheet?metal first?stage and inlet arrays
(4), and second stage array (5), which are attached, using indium foil
for a good thermal connection, at the cooling stations of the two?stage
helium expander. Refrigeration is produced at both the first stage and
second stage cooling stations. The lower the temperature produced, the
less efficient the refrigeration process. Therefore, greater refrigeration
capacity can be more readily produced at the first stage of expansion
(i.e., between 50K - 80K) than the second stage of expansion (i.e., between
10K - 20K).
Kimo, what do you mean by refrigeration capacity? It is the ability
of the refrigerator to sustain a given temperature at both the first and
second stage cooling stations for given input of power at each station.
When rating a refrigerators capacity, the convention is that the first
stage must be maintained at 77K and the second stage at 20K for a given
power input at each stage. For example, if the refrigeration capacity
is "2/15", this means that the refrigerator is capable of maintaining
a temperature of 20K at the second stage and 77K at the first stage with
2 watts of power input to the second stage and 15 watts of power input
to the first stage. A "5/35" refrigerator can sustain 20K and
77K with 5 watts and 35 watts input to the second and first stages respectively.
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Thermal Sources
There are three sources of heat (i.e., power) input to the cooling stations:
i) thermal radiation; ii) gaseous convection; and, iii) heat of
sorption losses. Because it is more difficult to produce refrigeration
capacity at 10K-20K, we shield the second stage array from room temperature
radiation from the work chamber and pump body (7) by completely surrounding
it with the first stage array, maintained at 50K-80K. This reduces the
radiation load on the second stage array by greater than a factor of 200.
Gaseous convection losses are negligible at pressures =10-5
torr. Keep this in mind when speculating that the increasing temperature
of the second stage of your cryopump is due to increasing pressure (i.e.,
is it a cause or an effect?).
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Sputtering Applications
Most sputtering applications occur at pressures of 1-20 millitorr. Such
pressures are required to sustain a sputtering glow discharge, and obtain
sufficiently high sputtering rates. Assume that a cryopump is used to
pump the chamber during a sputtering process, argon is used as the sputtering
gas, and the pump speed for argon is ~1500 L/s. If the pressure in the
sputtering chamber is, say, 10-2 torr, the throughput of argon
into the pump is just S × P = 1500 L/s × 10-2 torr = 15 torr-L/s.
As a rough rule of thumb, the heat of sorption when pumping gases is ~0.7
watts per torr-L/s. This implies that the thermal load on the second stage
of the cryopump, due to heat of sorption, would be ~ 10.5 watts. As light
bulbs go, this isn't very much power. But, at 2nd stage temperatures
of 10K-20K it suggest a fairly large refrigerator.
One technique to get around this problem is to remove the 1st
stage inlet array (4), and install a variable aperture plate in its place.
The variable aperture plate, secured to the first stage array with indium
foil, can be opened fully during system pumpdown, and then throttled back
to reduce argon pump speed during the sputtering operation. Because the
variable aperture is maintained 50K - 80K, a high water vapor pumping
speed is maintained during the sputtering process. This is desirable.
I was awarded a patent on a cryopump variable aperture plate,9
but confess, in retrospect, that it was more marketing than technology.
Let's think for a minute about possible alternatives. Let's assume that
we removed the inlet array and attached a fixed aperture plate (i.e.,
an aluminum plate with holes) in its place. Let's size the holes in the
plate to restrict the pumping speed for argon to 400 L/s. In order for
argon to be pumped, it must pass through the holes in the aperture plate
and be cryocondenced on the 2nd stage array. Yet, the aperture
plate, maintained at 50K - 80K, has a pumping speed for water vapor equivalent
to a "black hole" of the same diameter as the pump inlet. If
the speed for argon, due to aperture plate, is now 400 L/s, the throughput
during sputtering has been reduced to 4.0 torr-L/s, and the thermal load
on the second stage, due to the heat of sorption of argon, is now a modest
2.8 watts.
Some tool manufacturers solve the argon throughput problem by using a
room temperature throttle valve between the pump and chamber. When doing
this, they throttle the water vapor pumping as well as argon speed during
the sputtering process. Not a good tactic unless there is another means
of pumping the water vapor (e.g., Meissner coils) within the chamber.
With the fixed aperture
plate we've solved the argon throughput problem while maintaining a high
water vapor pumping speed. What about system pumpdown? Assume that each
chamber of the tool has a volume of 103 L - rather large for
a typical cluster-tool - and that the chamber is vented to 10-1
torr on insertion of the work through a load lock. If the gas is predominantly
water vapor, it will be instantaneously pumped away by the cold, fixed
aperture plate. If the gases comprise predominantly air, pressure in time,
P(t), will be as follows:
P(t) = 10-1×
e-(S/V)t torr (1)
where S is 470 L/s, V is 1000 L and t is the pumpdown time
in seconds. Let's see, after 1.0 second of chamber pumpdown the pressure
in the chamber will be 0.062 torr; in 10 seconds it will be ~9 ×
10-4 torr; in 30 seconds it will be ~7.2 × 10-8
torr. You get the picture. The key is restrict the argon throughput, but
maintain a high speed for water vapor. But, we have created a new control
problem. When using a throttle valve between the cryopump and chamber,
we are able to control the sputtering pressure in the chamber with some
form of feed-back loop between a vacuum gauge and the valve. With a fixed
aperture plate, we must have feed-back control circuitry between the same
vacuum gauge and a gas flow meter.
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Cryosorption Pumping
We noted in the June and July issues of VT&C that all gases except
water vapor (excluding some weird, heavy-molecule compounds) must be pumped
on the second stage array of the cryopump. In fact the gases He, H2
and Ne must be pumped on this surface by cryosorption. The effective cryosorption
of substantial quantities of these gases on 10K - 20K surfaces requires
a lot of surface area. We learned that activated coconut charcoal proved
very effective in this application. The charcoal or sieve material (6),
is glued to portions of the second stage array in a manner to hide it from
the immediate flux of gases which are cryocondenced when beaming onto this
array. However, gases which must be cryosorption pumped bounce around randomly
within the first stage array "can" and eventually find the charcoal.
The charcoal is thus reserved for the cryosorption pumping of He, H2 and
Ne, and in being hidden is saved from being plugged by the cryocondensing
gases.
Some form of temperature sensor is usually used to measure the temperature
of the second stage cooling station. This usually takes the form of a hydrogen
vapor bulb or a silicon diode sensor. In many applications silicon diodes
are attached proximate to and used for measuring temperatures of both the
first and second stage cooling stations of cryopumps. These prove useful
for control when regenerating the cryopump.
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A Little About the Refrigerators
An illustration of the cycle of a single-stage expander is given
in Fig. 2. The cooling cycle progresses from left to right, and down the
page from phase #1 to phase #6. The diagram seems a little busy, but let's
walk through it one step at a time. First, let's understand the components.
The expander comprises a motor-driven or pneumatic-driven displacer piston
which reciprocates within a thin-walled stainless steel cylinder. There
is a room-temperature gas seal located at the lower extremity of the displacer.
In a two-stage expander the seal of the 2nd stage displacer
is located proximate to the 1st stage cooling station (i.e.,
operate at a temperature of 50K to 80K). The displacer comprises a hollowed-out
phenolic-like cylinder within which resides a regenerator bed material.
This might comprise lead shot, bronze screens, or both. Because of the
seal, gas when entering or leaving the expansion chamber at the top of
the regenerator bed piston can do so only by coursing through the somewhat
transparent (i.e., to gas) regenerator bed. The regenerator bed material
is selected for its a high specific heat at cryogenic temperatures. High
pressure (HP) and low pressure (LP) helium valves introduce or exhaust
helium from the apparatus to the compressor, depending on the phase of
the cycle.
At #1 (i.e., phase #1 of the cycle), the HP He valve starts to open, and
HP He courses through the regenerator bed, eventually filling the void
above the displacer piston with high pressure gas. At #3, the helium pressurization
cycle is complete, and at #4 the LP He valve starts to open. The expanding
He produces refrigeration at the cooling station. Also - and this is the
secrete of how they work - as the cooled He passes back out through the
regenerator bed, it cools down the regenerator bed material (i.e., picks
up calories from the material; #4 & #5). In the next #1 cycle, as
the room temperature He passes through the regenerator bed to again fill
the expansion volume, it is precooled by the regenerator bed. During the
next expansion cycle, the chilled He becomes even colder, until after
several minutes a steady-state temperature is reached at the cooling station.
Two-stage expanders work exactly the same, except He reaching the 2nd
stage expansion volume is prechilled by both the 1st and 2nd
stage regenerator beds. Therefore, the regenerator bed serves as a thermal
ballast in the steady-state cycle. High pressure helium entering the expansion
volume is prechilled by the regenerator bed (i.e., the bed picks up calories),
whereas expanded helium on exiting through the regenerator bed, picks
up calories from the bed.
If there are contaminants in the He stream (e.g., oil or water vapor in
a single-stage expander; and any of the air gases in a two-stage expander)
they may coat or condense out on the regenerator bed material. When this
happens, the contaminant forms a thermal barrier between the bed material
and the He stream, and the refrigeration performance is degraded. This
can lead to very strange and misleading effects. Some of these effects
are discussed in reference 8.
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A Few Safety Issues
Cryopumped gases are retained within the pump as long as the pumping arrays
are maintained at cryogenic temperatures. On warming of the cryopump,
these gases are released. A pressure relief valve is located on the pump
body (e.g., see (8) of Fig. 1). This valve serves as a safety device to
prevent over-pressurization of the system on warm?up of the cryopump.
If you are pumping toxic or combustible gases, the relief valve should
be plumbed into some form of sealed off-gas disposal system. Talk with
the pump manufacturer prior to tinkering in any way with the pressure
relief valve.
A main valve should
be used to isolate the cryopump from the system. This is essential when
regenerating the pump, and has other safety considerations. Never use
an ionization gauge or other possible source of ignition on the pump side
of the main isolation valve.
Understand the chemistry of your process. It is possible that you may
be creating ozone or other mixtures of gases which may spontaneously ignite
when warming the pump. Consult with the pump manufacturer in this regard.
Review reference 7 and reference 8 (e.g., work the problems at the end
of Chapter 5) for other safety considerations.
Cryopumps, when properly
used serve as an economical, safe and reliable pumping means for most
applications. However, their limitation, as with all capture pumps, is
that they have a finite capacity for gases, and must be periodically regenerated.
The concepts of gas capacity and pump regeneration are discussed in detail
in references 7 and 8.
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References
1) M. H. Hablanian, High-Vacuum Technology, A Practical
Guide, 2nd Ed. (Marcel Decker, Inc., New York, 1997), pp 250-262.
2) C. R. Meissner, "A Versatile Ultra-high Vacuum System
for This Film Research", 1960 Vacuum Symposium Transactions (Pergamon
Press, Oxford, 1961), p.196.
3) F. Turner, "Cryosorption Pumping", Varian Tech
Pub., VR-76, 1972, Varian Associates, Inc., Palo Alto, CA.
4) K. M. Welch, Capture
Pumping Technology, 2nd Edition (Elsevier Science,
Amsterdam,2001), pp. 284-295.
5) R.C. Leever, "A Low Temperature Mechanically Refrigerated
Cold Trap", (Vacuum Symposium Transactions, American Vacuum Society,
1954), p. 19.
6) Polycold Systems is a subsidiary of Intermagnetics
General.
7) K.M. Welch, et al, "Recommended Practices for Measuring
the Performance and Characteristics of Closed-loop Gaseous Helium Cryopumps@,
J. Vac. Sci. Technol. A 17(5), Sept/Oct 1999, pp. 3081-3095.
8) K. M. Welch, Capture Pumping Technology, 2nd
Edition (Elsevier Science, Amsterdam, 2001), pp. 301-330.
9) U.S. Patent 4,285,710.
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Kimo has been
a member of the American Vacuum Society since 1958, and is a member of the
Society of Vacuum Coaters. He is Chair of the AVS Vacuum Technology Division,
an Emeritus member and Fellow of the AVS, and actively consults in related
technologies, and management operations.
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Copyright Kimo M. Welch, August 2000
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